Analytical electron microscopy study of growth mechanism for smoothing of metallic multilayer thin films
Applied Physics Letters, cilt.89, sa.16, 2006 (SCI-Expanded, Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 89 Sayı: 16
- Basım Tarihi: 2006
- Doi Numarası: 10.1063/1.2358958
- Dergi Adı: Applied Physics Letters
- Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
- Boğaziçi Üniversitesi Adresli: Hayır
Özet
We have used scanning transmission electron microscopy and electron energy-loss spectroscopy techniques to study the nature of interfacial interactions in a TaCu Ox stack that give rise to a smooth surface morphology, which can be utilized for seeding thin magnetic multilayer devices. Our measurements reveal that the interfacial smoothing is mainly due to the preferential reaction of Ta with O at the TaCu Ox interface assisted by grain boundary diffusion of oxygen which thereby acts to smooth out the surface roughness created by the large crystalline grains of Cu. © 2006 American Institute of Physics.